The WS 22 Wire Saw is a precision device with the capability to cut or slice hard and brittle materials, in particular semiconductor materials. The cutting operation is performed by tungsten wire covered with an oil or glycerin-suspended carbon abrasive slurry; the wire moves back and forth in an oscillating motion and cuts across the materials in the vertical plane. Therefore, slices with perfect parallel sides can be obtained, and the thickness of the slices can be reduced to 10@im. The Wire Saw assures absence of deformations or defects, and loss of material is minimized. For most semiconductor materials, the cutting rate is \fs16 1-3CM2 \fs24 /hour. The maximum swnple dimensions is 80nim X 80nun X 150nim. The Wire Saw is very useful in obtaining very thin slices for TEM sample preparation, especially the cross-section TEM samples.